8Devices
- Antakalnio g. 17, LT-10312 Vilnius, Lithuania
- evaldas.v@8devices.com
- www.8devices.com
Description
8devices is a European defence technology and equipment manufacturer developing advanced solutions for unmanned and autonomous systems. Our portfolio includes long-range wireless communication systems, tactical data radios, onboard processing and AI-enabled vision platforms, as well as thermal imaging cameras. 8devices products are designed for UAVs, counter-UAS systems, robotics and other mission-critical applications requiring secure and resilient connectivity, real-time data processing and reliable operation in demanding environments. From radio communication and telemetry links to edge processing and thermal imaging, we deliver integrated hardware and software solutions designed and manufactured in the European Union.
Products
Maca2
Maca2
Maca 2 is a compact, ultra-high-power data radio designed and manufactured in the European Union. It provides bidirectional connectivity at distances of up to 80 km, supporting MAVLink, telemetry, command-and-control, video and other data transmission. It is designed for unmanned aerial systems, robotics, counter-UAS platforms and other defence applications. Ultra-narrow channels, extended frequency coverage and precision frequency control help maintain stable links in congested or interfered RF environments. Robosoft firmware provides radio configuration, spectrum scanning, error-correction mechanisms and an optional unidirectional broadcast mode. Maca 2 is NDAA and TAA compliant.
Frequency range: 2202–2852 MHz;
Channel widths: 1.5–19.5 MHz in 0.5 MHz increments, plus 20/40 MHz.
Maximum output power: 36 dBm per chain and 39 dBm total.
Interfaces: 2× 100 Mbps Ethernet, USB 2.0, programmable GPIO, reset button, fan and slide switch. Antenna connectors: 2× MMCX.
Power input: 14–33 V DC; consumption at maximum output power: 23.2 W.
Dimensions: 73 × 47 × 23 mm.
Weight: 74 g.
Operating temperature: –40°C to +85°C
Channel widths: 1.5–19.5 MHz in 0.5 MHz increments, plus 20/40 MHz.
Maximum output power: 36 dBm per chain and 39 dBm total.
Interfaces: 2× 100 Mbps Ethernet, USB 2.0, programmable GPIO, reset button, fan and slide switch. Antenna connectors: 2× MMCX.
Power input: 14–33 V DC; consumption at maximum output power: 23.2 W.
Dimensions: 73 × 47 × 23 mm.
Weight: 74 g.
Operating temperature: –40°C to +85°C
RobonodeVision
RobonodeVision
RobonodeVision is a compact vision, processing and wireless connectivity platform for unmanned aerial vehicles, robotics and defence systems. It combines 4K video processing, edge AI acceleration, support for up to three cameras and bidirectional transmission of video, telemetry and control data. It provides high-performance long-range wireless connectivity and real-time onboard data processing.
Processor: Qualcomm QCS6490 with an octa-core Kryo 670 CPU and Adreno GPU.
AI acceleration: Qualcomm Hexagon DSP and 6th-generation Qualcomm AI Engine.
Wireless: 2×2 MU-MIMO and simultaneous dual-band operation in either 2 GHz + 5 GHz or 2 GHz + 6 GHz variants.
Output power: up to 27 dBm per chain at 2/5 GHz and up to 26 dBm at 6 GHz.
Cameras: 3× four-lane MIPI-CSI interfaces supporting up to three simultaneous inputs.
Video: H.264/H.265/VP9 decoding up to 4K at 60 fps; H.264/H.265 encoding up to 4K at 30 fps. Target end-to-end latency: below 100 ms.
Interfaces: 2× 1 Gbps Ethernet, USB 3.1, USB 2.0, UART, I²C, SPI, GPIO and MIPI-DSI. Antenna connectors: 2× MMCX.
Power input: 5–34 V DC.
Dimensions: 54.5 × 54.5 × 20.3 mm.
Operating temperature range: –40°C do +85°C.
AI acceleration: Qualcomm Hexagon DSP and 6th-generation Qualcomm AI Engine.
Wireless: 2×2 MU-MIMO and simultaneous dual-band operation in either 2 GHz + 5 GHz or 2 GHz + 6 GHz variants.
Output power: up to 27 dBm per chain at 2/5 GHz and up to 26 dBm at 6 GHz.
Cameras: 3× four-lane MIPI-CSI interfaces supporting up to three simultaneous inputs.
Video: H.264/H.265/VP9 decoding up to 4K at 60 fps; H.264/H.265 encoding up to 4K at 30 fps. Target end-to-end latency: below 100 ms.
Interfaces: 2× 1 Gbps Ethernet, USB 3.1, USB 2.0, UART, I²C, SPI, GPIO and MIPI-DSI. Antenna connectors: 2× MMCX.
Power input: 5–34 V DC.
Dimensions: 54.5 × 54.5 × 20.3 mm.
Operating temperature range: –40°C do +85°C.
