MSPO (2-5.09.2025)
33rd International Defence Industry Exhibition MSPO
"ALSTOR" A.ZWIERZYNSKI I WSPÓLNICY SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ
- ul. Wenecka 12, 03-244 Warszawa, Poland
- alstor@alstor.com.pl
- www.alstor.pl
Description
We invite you to visit the Alstor booth at MSPO – where we present technology designed for the toughest operational conditions, ensuring safety and reliability. On display: EIZO tactical, ATC and maritime monitors, IP decoders, imaging and video analysis systems, ultra-sensitive cameras, plus rugged graphics cards and video accessories built for extreme environments. The portfolio is complemented by Advantech solutions, including embedded computers and modules.
Rugged Tactical Monitors – EIZO Talon Series
• RGD2401W, 24” Full HD – compact, durable, with optional IP65, heaters, and high brightness. Ideal for command vehicles, artillery, radars, and reconnaissance.
• RGD3202W, 32” 4K UHD – for operation centers and tactical systems. Equipped with SwitchLink™, optional 12G-SDI input, MIL-STD-810G/461G compliant. Applications: C2 systems, liaison officer posts, UAV observation.
Imaging and Video Analytics
• SSZ-9700 – ultra-sensitive camera (0.003 lx) with DEFOG, HDR, 350× zoom. For drones, vehicles, towers.
• DuraVision EVS1VX – image processor with noise reduction, dynamic correction, USB recording. For monitoring centers and critical infrastructure.
IP Monitors & Decoders
• FDF2712W-IP – IP monitor with built-in decoder, supports 48 cameras, decodes 16 Full HD streams simultaneously. For securing military and industrial facilities.
• DX0212-IP – IP decoder, 64 cameras, dual 4K HDMI outputs, rack-mount. For anti-drone systems, border security, command centers.
Maritime Monitors (ECDIS/RADAR)
• FDS1904, 19” & MDF2701W, 27” – optical bonding for visibility and reduced condensation, ECDIS calibration, energy efficiency. For NATO fleets and research vessels.
Air Traffic Control Monitor
• Raptor SQ2826, 28.1” 2K×2K – sixth-generation ATC monitor with Last Frame Display, “at-the-glass” transmission, optional support for 6 workstations via SwitchLink. Fanless aluminum housing, 24/7 operation.
EIZO Rugged Solutions – Graphics & Video
• VPX cards – for GPGPU, AI, deep learning in harsh conditions.
• Video capture – XMC, 3U VPX, PCIe.
• Splitters & converters – energy-efficient, optimized for SWaP in defense and aerospace.
ADVANTECH – Reliable Computers, Modules & Systems
• SOM Series (System on Module) – COM Express (e.g., SOM-6884) with Intel CPUs, DDR5, QFCS cooling, offering scalability.
• AOM Series (AI on Module) – compact Nano AI modules (e.g., AOM-5521) for Edge Computing and real-time AI/IoT data processing.
• ROCK Series – rugged embedded PCs (e.g., ROCK-301) with IP65, MIL-STD-810H, fanless, powered by 13th Gen Intel processors.
Download
-
2025-08-MSPO-Ofertowka-Alstor-prev2.pdffile size: 507.24 KB
-
DFS2025-pl-cc2021.pdffile size: 3.23 MB
-
Zaawansowane-technologie-do-zadan-specjalnych-web.pdffile size: 4.10 MB
Products
Thanks to Optical Bonding technology, the screen maintains higher visibility compared to monitors without this feature, even at lower brightness levels. According to EIZO’s internal tests, a monitor without Optical Bonding would need a brightness of 1160 cd/m² to achieve visibility comparable to the DuraVision MDF2701W operating at just 350 cd/m².
Sunlight readability (high brightness variation)
NVIS support
EIZO LCD Flicker Compensation (E-LFC)
Internal switching management technology (SwitchLink)
Image enhancement technology
Picture-in-Picture and Picture-by-Picture
Optical bonding
EMI mesh filter
Heater for protection at low temperatures
Add or remove interfaces as required
Customized housing and optional monitor handles
19" rack-mountable
PCB conformal coating for protecting circuitry in harsh environments
Doskonała czytelność w świetle słonecznym dzięki szerokim wariantom wysokiej jasności
Pełna kompatybilność z systemami NVIS
Technologia kompensacji migotania obrazu EIZO LCD Flicker Compensation (E-LFC)
Zaawansowane wewnętrzne zarządzanie przełączaniem źródeł (SwitchLink)
Innowacyjne technologie poprawy jakości obrazu
Funkcje obrazu w obrazie (PiP) oraz obrazu obok obrazu (PbP)
Optical bonding – lepsza widoczność i odporność na kondensację pary
Filtr EMI ograniczający zakłócenia elektromagnetyczne
Zintegrowane ogrzewanie do pracy w niskich temperaturach
Elastyczna konfiguracja interfejsów – możliwość dodawania i usuwania według potrzeb
Obudowa dostosowana do wymagań, z opcjonalnymi uchwytami do przenoszenia
Możliwość montażu w szafie rack 19”
Powłoka ochronna PCB (conformal coating), zabezpieczająca elektronikę w trudnych warunkach środowiskowych