The LogInPack Congress has been created upon the initiative of leading companies operating in the logistics and packaging sector. The industry insiders resolved to create their knowledge and experience exchange platform, the arena to hold debates on the most important challenges and trends in these sectors. The event precedes the upcoming International Packaging Industry Trade Fair - IN-PACK 2024.

The congress agenda includes numerous discussion panels, presentations and workshops which bring together experts from Poland and abroad.

The Congress is divided into several thematic panels, whose topics range includes: Logistics in the face of war and AI digital transformation, Circular economy, Cutting-edge tools and instruments for logistics, Automation and robotization and Industrial solutions based on virtual reality. Discussions put the following topics into the limelight: packaging technologies, packaging design, automation of packaging processes, software for the packaging industry, packaging recycling, eco-packaging, and the packaging industry in Poland and Europe.

The Congress also offers the perfect opportunity to present the latest solutions and products; leading manufacturers and distributors from the logistics and packaging industry are an inherent part of the event.

The event is held at the Targi Kielce Congress Centre, a modern conference space. The venue guarantees the appropriate atmosphere for exchanging experiences and networking.

We look forward to seeing those who find the congress’ agenda interesting. Join the event and we will make sure the convention is a valuable experience for all participants.

International Congress for the logistics and packaging industry - LogInPack is held on 27 and 28 June 2023.

Venue:  TK Congress Centre

Those who want to become sponsors or partners of the Conference are offered several partner packages; for details contact the Organisers.